At SEMICON Taiwan in 2024, Powerchip Semiconductor Manufacturing Corporation officially showcased its latest Logic DRAM 3D wafer stacking technology. The launch of this technology marks a major breakthrough in the semiconductor industry's development of 3D AI chips, aimed at meeting the growing demand for high performance and low cost.

TSMC's Logic DRAM 3D wafer stacking technology combines advanced logic processes with efficient memory technology, providing an efficient solution for large-scale language modeling (LLM) AI applications and AI personal computers (PCs). Through this technology, TSMC can achieve a data transmission bandwidth 10 times that of traditional chips, while the power consumption is only 1/7 of traditional chips. This significant improvement in data transmission efficiency and reduced power consumption will bring tremendous assistance to the promotion and popularization of AI applications.

In the field of AI, especially with the increasing demand for Large Language Models (LLMs) and AI personal computers, traditional chips have become inadequate for processing large-scale data. TSMC's new technology is developed specifically for this market demand, providing up to 100 times the transmission bandwidth in the same area. This feature makes Deli Semiconductor's new chips highly competitive in the LLM and AI PC markets.

The success of TSMC in research and production is inseparable from its strategy of collaborating with well-known companies in the industry. Currently, TSMC has established close cooperative relationships with AMD, Japanese GPU design companies, and multiple international giants. The professional technology and market resources of these partners provide strong support for the development of TSMC's new 3D AI chips, ensuring their foresight in technology and market.

In addition, TSMC plans to continuously meet the market's demand for high-performance chips through continuous technological innovation and cooperation. Faced with changes in the global economy and rapid technological development, TSMC is committed to occupying a place in the fiercely competitive semiconductor market. The company's senior management stated that they will continue to increase research and development investment in the future, promote the implementation of more innovative technologies, and help customers achieve greater success in AI applications.

At the SEMICON Taiwan 2024 exhibition, TSMC's booth attracted the attention of many industry insiders. The attendees showed a strong interest in TSMC's technology, including future partners and customers. The technology demonstration of TSMC not only showcases its leading position in the semiconductor field, but also injects new vitality into the technological progress and market development of the entire industry.

The Logic DRAM 3D wafer stacking technology showcased by TSMC at the SEMICON Taiwan 2024 exhibition will undoubtedly open up new possibilities for chip development in the AI field. The advantages of this technology in improving data transmission bandwidth and reducing power consumption make it an important solution to meet the needs of modern AI applications. With the deepening of cooperation with major companies in the industry, the future performance of TSMC in the market is worth looking forward to.

Fushite Technology focuses on the field of power devices, providing customers with power devices such as IGBT and IPM modules, as well as MCU and touch chips. It is an electronic component supplier and solution provider with core technology.