On the evening of August 15th, TSMC, the world's leading semiconductor manufacturing giant, announced a major asset acquisition deal and officially reached an agreement with Innolux to acquire Innolux's Nanko plant and its complete set of ancillary facilities in Xinshi District, Tainan City for a price of up to NT $17.14 billion (approximately NT $3.788 billion). The factory building area involved in this transaction is huge, reaching 317444.93 square meters, marking another important expansion of TSMC in the field of advanced packaging.

The core purpose of TSMC's acquisition of the Qunchuang Tainan factory is to significantly enhance its CoWoS (Chip on Wafer on Substrate) advanced packaging technology production capacity. With the rapid development of semiconductor technology, advanced packaging has become a key factor in improving chip performance, power consumption ratio, and integration. As an industry leader, TSMC has always been committed to promoting technological innovation and capacity upgrading, and this acquisition is an indispensable part of its strategic planning.

It is reported that TSMC expects to establish a closer cooperative relationship with Innolux through this acquisition, jointly exploring and optimizing the application and development of advanced packaging technology. By 2025, TSMC plans to continue expanding its production capacity on this basis to meet the growing demand for high-performance chips in the global market.

It is particularly worth mentioning that TSMC's layout in the field of advanced packaging goes far beyond this. The company is actively exploring and developing an innovative packaging technology that will replace traditional circular wafers with rectangular substrates. The aim is to further improve packaging efficiency and effectively reduce production costs through this design change. This innovative measure not only reflects TSMC's profound technological accumulation in the field of semiconductor packaging, but also indicates that chip packaging technology will move towards a more efficient and economical new stage in the future.

In summary, TSMC's acquisition of the Qunchuang Tainan factory is not only an important step in its expansion of advanced packaging capacity, but also a profound impact on the global semiconductor industry landscape. With the continuous breakthroughs and applications of advanced packaging technology, TSMC is expected to occupy a more stable leading position in the global semiconductor market, leading the industry towards a more brilliant future.

Fushite Technology focuses on the field of power devices, providing customers with power devices such as IGBT and IPM modules, as well as MCU and touch chips. It is an electronic component supplier and solution provider with core technology.